Samsung supplies HBM4 memory for AMD Helios rack
Samsung Electronics is supplying mass-produced HBM4 memory for AMD's Helios AI server rack as the system enters production to compete with Nvidia, with shipments scheduled to start late in the third quarter and expand into the fourth. Each Helios cabinet integrates 72 Instinct MI455X accelerators and can support up to 432 gigabytes of HBM4 per accelerator, totaling about 31 terabytes per rack; Samsung's 36GB HBM4 stacks mean roughly twelve stacks per accelerator. AMD cites 50 percent more memory and 6 percent higher bandwidth than Nvidia, and major customers have staged commitments through 2027.
Samsung will ship HBM4 for Helios racks starting late third quarter.
Context
AMD announced Helios production and a Samsung supply deal at its Seoul conference. Shipments are due late in the third quarter and may expand in the fourth quarter. Customer deployments are staggered and could continue through 2027.
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