SK hynix plans US listing to fund new chip fabs

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Counterpoint Research analyst MS Hwang said SK hynix aims to overtake Samsung in the hot memory chip market and will pursue volume leadership as well as HBM leadership. SK hynix told AFP it plans to use proceeds from a US listing to fund construction of the first fab at a new semiconductor cluster in Yongin near Seoul and to build an advanced packaging facility in Cheongju, among other projects. The company and Samsung are part of a massive public‑private 800 trillion won investment to build a new chip hub, while the AI chip boom has intensified debate over tax windfalls and worker pay.

SK hynix will use US listing proceeds to build new fabs.