Huawei expands Ascend 960 systems with UnifiedBus interconnect
Huawei outlined an expanded Ascend 960 roadmap and an interconnect called UnifiedBus to link thousands of processors, memory, and storage with lower communication overhead. The Atlas 960 SuperPoD roadmap reaches 15,488 processors, 34 PB/s interconnect bandwidth, 30 EFLOPS FP8 (60 EFLOPS FP4), and 4,460 TB memory, while the Atlas 960E ties up to 4,096 NPUs and supports models up to 10 trillion parameters. Huawei also plans earlier Ascend 960DT and 960PR chips in 2027 and promises Ascend 970 and 980 in 2028–2029, using Hi-ONE optics and near-packaged optics to reduce power and module counts.
UnifiedBus enables large-scale processor interconnection with reduced communication overhead
Context
Huawei expanded its Ascend roadmap and introduced UnifiedBus in response to scaling limits. The company may now push larger systems and new chips in 2027 to 2029.
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