SK Hynix breaks ground on Indiana HBM packaging plant
SK Hynix has started construction on a more than $4 billion advanced packaging facility in West Lafayette, Indiana, its first U.S. production base for high-bandwidth memory (HBM). The plant will package wafers made in South Korea and include an advanced packaging R&D center with a Purdue agreement. The company says the project will create about 7,000 direct and indirect jobs, with roughly 1,000 employed at the site. The U.S. Commerce Department finalized up to $458 million in CHIPS Act funding and offered loans, and Indiana may provide up to about $712 million in state grants.
First U.S. HBM packaging plant to start mass production in 2029
Context
The U.S. has pressed memory makers to expand domestic capacity. SK Hynix is expanding both in South Korea and now in Indiana. The plant plans a first cleanroom in October 2028 and mass production in the second half of 2029.
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