Huawei advances AI chip launches and interconnect system
Huawei announced accelerated release dates for two Ascend 960 series AI chips, bringing the 960DT to the first quarter and the 960PR to the third quarter of next year, and said it will advance one chip generation per year through 2029. The company is also developing a UnifiedBus interconnect to link many chips at large scale and said a supercluster could support up to 1 million AI processors. The steps follow China’s limits on Nvidia access, a declared three-year chip plan, and come ahead of U.S.-China summit talks where technology and semiconductor rules are expected to be central.
Huawei moved Ascend 960DT and 960PR launches earlier.
Context
China could not use top-spec chips after export controls last year. Huawei then announced a three-year chip plan and a de-Nvidia approach. Next, summit talks may address technology rules and trade measures.
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